Products

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MACOM’s European Semiconductor Center offers a portfolio of MMIC products up to 110 GHz.

 

MACOM’s European Semiconductor Center offers a comprehensive portfolio of MMIC products fabricated on high performance gallium nitride-on-silicon (GaN-on-Si) and gallium arsenide (GaAs) processes. These technologies allow the delivery of MMIC solutions covering DC to 110GHz.  The portfolio of products below are offered as bare die, tabbed and packaged MMIC solutions.

Power Amplifiers

The power amplifier (PA) portfolio is designed and optimized for use in telecommunications, instrumentation, radar, satcom and A&D applications. Our PAs are fabricated using captive short gate length GaAs and GaN-on-Si technology that allows MACOM to deliver differentiated amplifier performance.   

 

Product Freq. Min (GHz) Freq. Max (GHz) Gain (dB)   (dBm) PAE (%) BIAS Currant (A) Drain Voltage (V) Package Board Process
CGY2135UH/C1 18 23 25 33 20.2 1.2 4 Die Yes D01PH

MAAP-011410-DIE

27

31

22

 40.5

22

 0.93

12

Die

 Yes

 D01GH

MAAP-011413-DIE

32

38

20

 40

28

 0.7

12

Die

 Yes

 D01GH

MAAP-011422-DIE

6

18

20

 40.5

33

 1.0

12

Die

 Yes

 D01GH

MAAP-011420-DIE 1 40 15 30.0 15 220 18 Die Yes D01GH

Low Noise Amplifiers

The LNA portfolio is manufactured using  pHEMT and mHEMT technologies (ED02AH, D01PH(S), D01MH). MACOM mHEMT LNAs deliver superior noise figure performance up to 110GHz.  LNAs fabricated on GaN-on-Si technology are also offered. The higher breakdown voltage and low noise performance makes GaN-on-Si an ideal technology for developing higher power LNAs. GaN-on-Si LNAs have demonstrated survivability with high input power and fast recovery. 

 

PRODUCT Freq. Min (GHz) Freq. Max (GHz) GAIN (dB) NF (dB) OP1dB (dBm) BIAS Current (mA) BIAS Voltage (V) Package Board Process
CGY2106XHV 0.1 3 19 0.45 35 100 5 QFN 4x4   D01PH
CGY2105XHV 0.5 4 19 0.42   35 100 5 QFN 4x4   D01PH
CGY2107HV 0.5 6 24 0.5 36 100 5 QFN 4x4   ED02AH
CGY2108GS 0.5 6 21 0.6 36 100 5 Hermetic Glass Seal Yes ED02AH
CGY2108HV 0.5 6 22 0.5 36 100 5 QFN 4x4   D01PH
CGY2220UH/C1 1 12 35 1.3 12 52 1.5 Die   D007IH
CGY2230UH/C1 1 18 35 1.5 12 50 1.5 Die   D007IH
CGY2178UH/C1 5 6 30 1 15 40 3 Die   ED02AH
CGY2120XUH/C1 5 7 13 0.5 12 50 1 Die    
CGY2290SUH/C1 6 18 9 3.3 13 33 5 Die   ED02AH
CGY2221HV/C1 7.5 13 16 1.6 17 82 5 QFN 4x4   D01PH
CGY2124UH/C1 8 12 33 1.1 11 55 5 Die Yes D01PH
CGY2221UH/C1 8 12 16 1.6 17 82 5 Die   D01PH
CGY2232UH/C1 12 15 27 1.3 0 50 3 Die    
CGY2125AUH/C1 13 15 25 1 8 20 3.3 Die   D01MH
CGY2121XUH/C2 18 26 19 1.5 5 60 0.8 Die Yes D007IH
CGY2128UH/C2 24 34 24 1.3 11 47 3.5 Die   D01MH
CGY2260UH/C1 25 43 25.5 1.7 6 50 1.5 Die Yes D007IH
CGY2122XUH/C2 25 43 32 1.5 1 30 1.1 Die Yes D007IH
CGY2272UH 44 70 25 2 5 40 1.1 Die Yes D007IH
CGY2190UH/C2 75 110 23 2.8 1 33 1 Die   D007IH

MAAL-011250-DIE

8

12

20

1.4

15

150

8

Die

 Yes

 D01GH

MAAL-011251-DIE

24

34

18

1.6

5

 50

8

Die

 Yes

 D01GH

MAAL-011245-DIE

27 31.5 27 1.3 5 47 1.5 Die    

MAAL-011246-DIE

22 48 27 1.5 5 50 1.5 Die    
MAAL-011258 13 15 27 1.7 4 29 3 QFN 4x20    
MAAL-011272 8 12 33 1.5 10 50 5 PQFN    

Wideband Amplifiers

The wideband amplifier portfolio is manufactured using 130 nm gate length GaAs pHEMT technology D01PH(S) or 100 nm GaN HEMT technology D01GH. These products are designed for test and measurement, A&D, and optical communications applications.     

PRODUCT Freq. Min (GHz) Freq. Max (GHz) Gain (dB) NF (dB) P1dB OUT (dBm) Supply Current (A) Supply Voltage (V) Package Process
CGY2141UH/C1 0.01 46 16 4 21 195 5 Die D01PH
CGY2144UH/C2 0.01 54 13 2.5 15 100 5 Die D01PH
CGY2145UH/C1 0.5 45 13 2.6 18 85 5 Die D01PH
CGY2160UH/C1 1.5 47 15 2.5 19 103 5 Die D01PH

 

Gain Block Amplifiers

The gain block amplifiers portfolio is designed for industrial, wireless infrastructure and A&D applications. These gain block amplifiers are manufactured using GaAs technology (D01PH(S)).    

PRODUCT Freq. Min (GHz) Freq. Max (GHz) Gain (dB) NF (dB) Psat (dBm) Package Process
CGY2731UH/C1 12 15 19 4 10 Die D01PH

 

Corechips (PS + ATT)

Core chips integrate digital phase shifter, digital attenuator, LNAs, MPAs and switches for phased array antenna applications. Phase and gain are controlled through a serial to parallel interface on the die (SIPO).  

Product Access Freq. Min (GHz) Freq. Max (GHz) Interface BITS RMS Attentuation / Phase Range Package Board Process
CGY2175AHV/C1 3 ports 4.5 6.5 CMOS, Serial 6 0.5 dB / 2° 31.5 dB / 360° QFN 7x7 Yes ED02AH
CGY2175AUH/C1 3 ports 4.5 6.5 CMOS, Serial 6 0.2 dB / 1.3° 31.5 dB / 360° Die Yes ED02AH
CGY2170YHV/C1 3 ports 8 12 CMOS, Serial 6 0.5 dB / 4° 31.5 dB / 360° QFN 7x7 Yes ED02AH
CGY2170YUH/C1 3 ports 8 12 CMOS, Serial 6 0.4 dB / 3° 31.5 dB / 360° Die Yes ED02AH
CGY2330UH/C1 2 Ports 12 15 Serial 6 0.5 dB / 11.25° 15 dB / 348.8° Die   ED02AH
CGY2351UH/C1 2 Ports 26.5 30.5 Serial 6 0.5 dB / 4° 22 dB / 360° Die   ED02AH
CGY2350UH/C1 2 Ports 34 36 Serial 5 0.5 dB / 5° 15 dB / 348.8° Die Yes ED02AH

 

RX Corechips

 

PRODUCT Function Freq. Min (GHz) Freq. Max (GHz) Gain (dB) NF (dB) OP1dB (dBm) BITS Phase Error RMS (°) Package Process
CGY2179HV/C1 4 bits PS+LNA 10.7 12.75 12 2 3 4 7 QFN ED02AH
CGY2179UH/C1 4 bit PS+LNA 10.7 12.75 12 2 3 4 7 Die ED02AH

 

True Time Delay

True time delay functions, with 1-bit and 5-bit control, operating from 6 to 18 GHz and with delays from 10ps to 330 ps are also offered in the portfolio. 

PRODUCT Freq. Min (GHz) Freq. Max (GHz) BITS Min Delay (ps) Full Delay (ps) Isertion Loss (dB) CTRL Interface (V) Package Board Process
CGY2393SUH/C1 6 18 5 10 310 6 0 / +4 Die Yes ED02AH
CGY2394SUH/C1 6 18 1 330 330 6 0 / +4 Die Yes ED02AH

 

Digital Phase Shifter

Digital phase shifters from 4.8 GHz to 18 GHz manufactured using the ED02AH GaAs pHEMT process are also offered. Phase shifters are designed for communications, and A&D applications. 

Product Freq. Min (GHz) Freq. Max (GHz) Phase Control (°) Insertion Loss (dB) IP1dB (dBm) BITS Phase Error RMS (°) Interface Package Board Process
CGY2177AUH/C1 4.8 6.8 360 5 20 6 2 0 / +5 V Die   ED02AH
CGY2173UH/C2 6 18 360 13 27 6 4 0 / -3 V Die Yes ED02AH
CGY2392SHV/C1 6 18 360 10.8 20 6 1.09 0 / +5 V QFN 5x5   ED02AH
CGY2392SUH/C1 6 18 360 10.8 20 6 1.7 0 / +5 V Die Yes ED02AH
CGY2172XBUH/C1 8 12 360 8 18 6 3 0 / +5 V Die   ED02AH
CGY2174UH/C1 14 16 360 8 20 6 6 0 / -3 V Die   ED02AH

 


 

Digital Attenuator

Attenuators from 1 to 18 GHz manufactured using the ED02AH GaAs pHEMT process are also offered.

Product Freq. Min (GHz) Freq. Max (GHz) Amplitude Control (dB) Insertion Loss (dB) IP1dB (dBm) BITS RMS Atten. (dB) CTRL Interface (V) Package Process
CGY2171XBUH/C1 1 15 31.5 5 20 6 0.25 0 / +3 V Die ED02AH
CGY2176AUH/C1 1 8 31.5 5.6 - 6 0.2 0 / +5 V Die ED02AH
CGY2390SUH/C1 6 18 35 2.2 - 3 0.2 0 / +5 V Die ED02AH
CGY2169UH/C1 10 18 23.5 4 20 6 0.4 0 / -3 V Die ED02AH

 

Switches

Switches include discrete components from single-pole-single-throw (SPST) to single-pole-dual-throw (SPDT). These switch products showcase high isolation, low loss and large power handling. They are designed using GaAs or GaN HEMT technologies.  

Product Freq. Min (GHz) Freq. Max (GHz) Isolation(dB) Insertion Loss (dB) Switching Speed (ns) Package Process
CGY2890SUH/C1 6 18 > 50 1.5   Die ED02AH

Wideband Mixers

Wideband mixers that are manufactured using GaAs 180 nm E/D pHEMT (ED02AH) and 70 nm mHEMT (D007IH) technologies are also offered. These wideband mixers feature high isolation and are designed for radar, telecommunications and instrumentation applications.   

Product Converter Freq. Min (GHz) Freq. Max (GHz) LO Freq (GHz) IF Freq (GHz) LO Input Power (dBm) Conv. Gain (dB) OP1dB (dBm) Package Process
CGY2183UH/C1 Active Down 0.1 6 0.1 - 6 DC - 3 -5 11 -5 Die ED02AH
CGY2184UH/C1 Active Down 0.1 6 0.1 - 6 DC - 3 0 18 3 Die ED02AH
CGY2180UH/C1 Up & Down 0.7 3.7 0.7 - 4 DC - 2 12 -7 5 Die ED02AH
CGY2181UH/C1 Up & Down 1 4.5 1 -  5 DC - 2 15 -7 6 Die ED02AH
CGY2182UH/C1 Up & Down 3 10 3 - 10 DC - 3 15 -7 5 Die ED02AH

 

Transimpedance Amplifiers

The portfolio includes transimpedance amplifiers (TIAs) supporting data rates up to 43 Gb/s for optical fiber communications applications.

PRODUCT Function DATA RATE (Gb/s) DIFF GAIN (dBΩ) INPUT OVER-LOAD (mApp) ON CHIP AGC CURRENT (mA) POWER SUPPLY (V) Package Board Status Process
CGY2144UH/C2 TIA 43 49 3.5 No 100 5 Die   Prod D01PH